True Integration has a line of equipment to support automatic test equipment for the semiconductor industry. All designs are based on the core intellectual property and customized to fit the exact need of the customer for the test configuration and application.

Standard products include BGA test sockets, test head positioning systems and
mechanical docking systems. Custom Innovative Interface Solutions are also
available.


Test Head Manipulators/Positioning Systems

We offer a line of test head positioning systems for test head weights of 25 pounds to 1,000 pounds These models provide a simply advanced mechanical technology design that takes advantage of a proven constant force counterbalance system to float the test head in combination with a failsafe load arrestor unit that can reset itself for the life of the system. Without counterweights the column mass is significantly reduced resulting in a low center of gravity. Also there is no need to perform an expensive disassembly and repair process if a load imbalance should occur.

These systems provide full motion floating test head action and are lighter, easier to adjust, more maneuverable, have better safety features and cost less than the competition! They arrive fully assembled and ready to go. Docking solutions are available for every production test application. Click here for an application guide to select a model that meets your requirements:

http://www.signaltransfer.com/acrobat_files/model_ident.pdf

Docking Solutions

Pneumatic and mechanical docking solutions are available for any test or wafer
sort set-up. The operator need only to place the test head into rough alignment
position and then push the button. These fail-safe docking systems take
care of the rest. By design it will self-align for perfect docking when equipment is
not coplanar. Calibration bars are not needed and accuracy is to 1/4mm.
These pneumatic docking systems are robust and have very long life in rigorous
test floor environments.



Sockets

A variety of configurable, long-life sockets and contactor sets are available. Our patented designs include the Configurable High Insertion Count (CHIC) Socket allows users of programming and automatic test equipment to accommodate a BGA, QFN, MLF or any lead-less package. The socket also improves electrical contact reliability compared to conventional burn-in style socket technology and has a very long cycle life. These sockets are a perfect match for programmable memory and Flash memory devices. For more information see:

http://www.signaltransfer.com/CHIC.htm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

       
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